PLX Series

Pure Lead is used to optimize the high rate and float life. Punched continuous grid strip – better metal crystal structure. Continuous, double pasting process – high consistency and reliability. High temperature curing for standby application to improve cycle ability. COS welding, TTP and ABS heat sealing - low internal resistance and low self-discharging rate rapid charging acceptance and cyclic endurance for a superior performance in extreme environmental conditions. Jar formation is involved which is more under Environment friendly consideration.

Specification Features Application Curves

Model	Rated Voltage	W15	10Hr	Length	Width	Height	TH	Weight	Terminal
Model	V	1.67V/ cell	1.80V/ cell	mm	mm	mm	mm	kg	Terminal
PLX12-260FT(A)	12	260	62	298.7	97	267	267	19.5	T6(M6)
PLX12-400FT(A)	12	400	100	405.4	108	287	287	31.5	M8(M6 optional)
PLX12-450FT(A)	12	450	110	559	125	227	227	37.7	M8(M6 optional)
PLX12-620FT(A)	12	620	150	559	125	277	277	48.5	M8(M6 optional)
PLX12-700FT(A)	12	700	190	559	125	320	320	58.0	M8(M6 optional)
PLX12-730FT	12	730	200	571	125	320	320	61.0	M8(M6 optional)
PLX12-240	12	240	50	229	138	200	203	16.9	M6/M8
PLX12-330	12	330	80	260	168	208	211	25.3	M6/M8
PLX12-405	12	405	92.8	306	168	207	210	30.1	M6/M8
PLX12-420	12	420	100	340.9	170	213.2	215.7	33.5	M6/M8
PLX12-460	12	460	105	340.9	170	213.2	215.7	33.8	M6/M8
PLX12-500	12	500	125	340.9	170	273.2	275.7	41.7	M6/M8
PLX12-540	12	540	135	340.9	170	273.2	275.7	43.5	M6/M8
PLX12-620	12	620	145	340.9	170	273.2	275.7	44.0	M6/M8

Parameter information subject to the contract, here for your reference only.

Pure Lead used to optimize the high rate and float life.
Punched continuous grid strip – better metal crystal structure
Continuous, double pasting process – high consistency and reliability
High Temperature Curing for Standby application to improve cycling ability
COS welding, TTP and ABS heat sealing - Low internal resistance and Low self-discharging rate
rapid charging acceptance and cyclic endurance for a superior performance in extreme environmental conditions.
Jar formation is involved which is more under Environment friendly consideration

Terminal